2024半导体技术论坛将于2024年11月29-30日在上海举行。本次大会由复旦大学主办，诚邀全球学者共同探讨半导体领域最新研究热点和技术发展趋势。大会主会场将邀请半导体领域国际知名学者莅临做主旨报告，同时设“先进工艺与制造”、“先进封装与散热”、“半导体物理”三个分论坛，邀请国内外杰出中青年学者分享最新的研究成果。大会将汇集200多位学界、业界顶级技术专家，深入探讨技术趋势和热点话题，携手推动半导体领域技术创新及发展。期待您的莅临和分享！

The 2024 Semiconductor Technology Forum will be held in Shanghai,China on November 29-30, 2024. Hosted by Fudan University, the conference will invite global scholars to discuss the latest research hotspots and technological development trends in the semiconductor field. The main venue will feature keynote presentations from internationally renowned scholars in the semiconductor sector, along with three sub-forums on "Advanced Processes and Manufacturing," "Advanced Packaging and Thermal Management," and "Semiconductor Physics," where outstanding scholars from both domestic and international backgrounds will share their latest research findings. The conference will gather over 200 top technical experts from academia and industry to delve into technological trends and hot topics, collaboratively promoting innovation and development in the semiconductor field. We look forward to your presence!