无线集成电路与系统实验室（WiCAS）
Wireless Integrated Circuit and System Lab
MS/PhD/Postdoc positions open！
现招收品学兼优、勇于创新的硕士生、博士生以及博士后。
欢迎有志于从事人工智能算法、射频／模拟／数字IC、天线、智能系统研究的同学加入。
实验室为学生提供与工业界接轨的设计理念，开放包容的科研环境和帮助优秀学生提供工业界实习机会。
WiCAS课题组研究方向：
人工智能增强无线集成电路、算法与系统 AI for Wireless （AI4W）
先进CMOS工艺上的高性能收发机架构与芯片设计
应用于智能传感器和5G/6G通讯的毫米波集成电路与系统
面向智能物联网等新型应用的无线SoC芯片与算法一体化微系统
教育背景
美国加州大学圣芭芭拉分校，电子与计算机工程，博士
美国加州大学圣芭芭拉分校，经济学，硕士
上海复旦大学，电子工程，学士
工作经历：
2015年-至今复旦大学微电子学院，研究员，博士生导师
2005年-2015年英特尔公司 (Intel Corp) ，英特尔研究院（Intel Labs）主管研究科学家
主要成果及荣誉
IEEE 高级会员
累计发表150+篇期刊会议论文：
无线集成电路：12 ISSCC; 17 JSSC; 2 TCASI; 3 RFIC; 2 CICC; 4 VLSI-C; 4 ESSERC
微波电路与系统：4 TMTT; 10 MWCL; 4 IMS; 2 CSICS
器件与工艺：2 EDL; 1 VLSI-T; 1 DRC
天线/算法：1 TAP, 1 TRS, 1 DAC
13项美国专利
2篇英文著作
近期国际学术重要职务
IEEE JSSC 副主编 2024至今
IEEE MWTL 副主编 2019-2024
IEEE 国际固态电路会议 ISSCC 技术评审委员 2020-2025
IEEE 国际射频集成电路会议 RFIC 指导委员/技术评审委员2015-2024
IEEE 国际电子器件会议 IEDM 技术评审委员 2021-2022
IEEE 国际无线会议 IWS 技术评审委员 2013-2020
IEEE JSSC 客座编辑 Guest Editor 2019-2020
行业研发经历
1.高集成度智能毫米波传感器SoC
·集成毫米波收发机、超宽带调频锁相环、高精度ADC、信号处理加速器、电源管理等关键功能的单芯片智能毫米波传感器SoC。广泛应用于自动驾驶、无人机、机器人、智能家居等多样化智能物联网领域。
2.超低功耗SoC系统开发项目
·业界首枚14纳米CMOS无线低功耗WiFi SoC芯片，应用于搭建无线传感网、物联网和可穿戴设备。
3.先进CMOS工艺下高性能无线收发机的设计
·超过20年包括收发机前端的无线射频元件，无线系统开发及射频电路数字化创新。经历从90纳米到14纳米的无线系统开发，开发出用于低功耗和低成本无线系统的颠覆性的无线收发机的架构，并应用于英特尔无线通讯产品中。
4.高性能CMOS数字射频功率放大器（PA）
·领导并研发了多款高性能CMOS功率放大器。其中首创的outphasing和dynamic power control数字式功率放大器，成果证明了用数字方法实现射频的射频功率放大器，性能可以超越传统的设计方式，成为行业性能标杆。
5.全集成基于高性能GaN HEMT的微波电路（MMIC）
·净化间微波GaN HEMT器件工艺开发，完成从微波器件制造，工艺集成到电路建模和设计流程，设计开发包括PA，VCO和LNA在内的高性能微波电路。
·首创了可集成在化合物半导体上的可调制铁电材料器件制造工艺，极大减小微波元件的尺寸，并设计高性能自适应的微波电路。
论文选摘
1. X. Ma, W. Li, S. Dong, R. Lyu, F. Chen, Y. Pu, C. Wang and Hongtao Xu, “A Compact Full-Duplex Receiver with Wideband Multi-Domain Hilbert-Transform-Equalization Cancellation Based on Multi-Stage APFs Achieving 65dB SIC Across 120MHz BW”, 2025 IEEE International Solid-State Circuits Conference (ISSCC), 2025, February 16-20
2. C. Hu, J. Li, J. Lin, Hongtao Xu and Y. Yin, “A Wideband Replicas-Rejection Digital Transmitter Using Joint-Digital-Analog Interpolation and Filtering in 28nm CMOS”, 2025 IEEE International Solid-State Circuits Conference (ISSCC), 2025, February 16-20
3. W. Zuo, Y. Wang, S. Han, Y. Li, W. Li, Y. Lin and Hongtao Xu, A 2.4-GHz-BW 59.7-dB-Range 0.39-dB-Error dB-Linear VGA Featuring –40 ∘C~110 ∘C and ±10%-Supply PVT Robustness in 40-Nm CMOS, IEEE Journal of Solid-State Circuits (JSSC), 2025, Early Access
4. S. Han, Y. Wang, Y. Li, W. Zuo, W. Li, Y. Yin, Y. Lin and Hongtao Xu, A 1–21-GHz, 1.95–3.1-dB NF Ultra-Wideband LNA With Gm-Assisted-Feedback Noise Suppression Achieving 140-Gb/s Data Rate in 40-nm CMOS, IEEE Journal of Solid-State Circuits (JSSC), 2025, Early Access
5. J. Li, Z. Li, Y. Yin, C. Yan, N. Qi, M. Liu and Hongtao Xu, A Six-Phase Harmonic-Rejection Digital Transmitter, IEEE Journal of Solid-State Circuits (JSSC), 2025, Early Access
6. B. Yu, K. Xu, W. Li and Hongtao Xu, “A 31.92% Efficiency Colpitts DCO-PA for BLE TX with Implicit RX Clock Generation Using DM-to-CM Mode-switching”, 2024 IEEE Asian Solid-State Circuits Conference (A-SSCC), 2024, November 18-21
7. F. Gao, L. Guo, Y. Li, Y. Yin and Hongtao Xu, “Nonlinear Analysis of Quadrature Switched-Capacitor Power Amplifier and Digital Predistortion”, IEEE Transactions on Circuits and Systems I: Regular Papers(TCAS-I), 2024, 71(12), 6255 - 6264
8. B. Jiang, P. Li, S. Zheng, Y. Lin and Hongtao Xu, “A 24-GHz Beam-Steerable Multinode Wireless Power Transfer System With a Maximum DC Output of 5.7 dBm at 1-m Distance”, IEEE Transactions on Microwave Theory and Techniques (TMTT), 2024, 72(11), 6774 - 6789
9. R. Liu, X. Song, J. Qian, S. Hao, Yue Lin and Hongtao Xu, “A Data-Driven Method for Indoor Radar Ghost Recognition With Environmental Mapping”, IEEE Transactions on Radar Systems (TRS), 2024, 2(9), 910-923
10. W. Zuo, Y. Wang, S. Han, Y. Li, W. Li, Y. Lin and Hongtao Xu, “A PVT-Robust 2.4-GHz-BW 59.7-dB-Range 0.39-dB-Error dB-Linear VGA with Self-Compensated Exponential Generator and Self-Adaptive Bias”, 2024 IEEE European Solid-State Electronics Research Conference (ESSERC), 2024, September 9-12
11. Y. Li, Y. Wang, S. Han, Z. Deng, W. Zuo, W. Li, Y. Lin and Hongtao Xu, “A 1.5-to-23.5 GHz High-Power-Density Distributed PA Achieving 150.5 Gb/s Data Rate With 14.4 dBm Pavg Supporting 64/128/256-QAM in 40-nm CMOS”, 2024 IEEE European Solid-State Electronics Research Conference (ESSERC), 2024, September 9-12
12. W. Zeng, L. Gao, N-Z. Sun, H-Y. Li, J-X. Xu, Hongtao Xu, Q. Xue and X. Zhang, A Compact 19.7- to 43.8-GHz Power Amplifier With 20.3-dBm Psat and 35.5% PAE in 28-nm Bulk CMOS, IEEE Journal of Solid-State Circuits (JSSC), 2024, 59(8), 2455-2468
13. Y. Li, Y. Yin, D. Zheng, F. Gao, J. Lin, Z. Hu, Y. Lu and Hongtao Xu, A Quadrature Digital Power Amplifier With Wide Efficiency Enhancement Coverage and High Dynamic Power Range, IEEE Journal of Solid-State Circuits (JSSC), 2024, 59(7), 2133-2144
14. S. Han, Y. Wang, Y. Li, W. Zuo, W. Li, Y. Lin and Hongtao Xu, A 140-Gbps 1-to-21-GHz Ultra-Wideband LNA Achieving 1.95-to-3-dB NF Using Gm-Assisted-Feedback Noise Suppression Technique in 40nm Bulk CMOS, 2024 IEEE Symposium on VLSI Technology and Circuits (VLSI-C), 2024, Jun 16-20
15. W. Zeng, L. Gao, H-Y. Li, J-X. Xu, Hongtao Xu and X. Y. Zhang , “A Tri-Mode Filtering Power Amplifier for 5G Millimeter-Wave Dual-Side LO Injection Systems with Power-Efficiency Enhancement”, IEEE Custom Integrated Circuits Conference (CICC), 2024, April 21-24
16. J. Li, Z. Li, Y. Yin, C. Yan, N. Qi, M. Liu and Hongtao Xu, “4.4 A Highly-Integrated 6-Phase Cell-Reused Digital Transmitter Using 1/3 Duty-Cycle LO Signals for Harmonic Rejection”, 2024 IEEE International Solid-State Circuits Conference (ISSCC), 2024, February 18-22
17. J. Li, Y. Yin, H. Chen, J. Lin, Y. Li, X. Jia, Z. Hu, Z. Liu, X. Zhang and Hongtao Xu, “A Transformer-Based Quadrature Doherty Digital Power Amplifier With 4.1 W Peak Power in 28 nm Bulk CMOS”, IEEE Journal of Solid-State Circuits (JSSC), 2023, 58(12), 3296-3307
18. C. Wang, X. Ma, W. Li, F. Chen, W. Zuo, Y. Pu, J. Zhou and Hongtao Xu, “A Wideband Full-Duplex Receiver With Multi-Domain Self-Interference Cancellation Based on Capacitor Stacking Delay and Delay Compensation in Cancellers”, IEEE Journal of Solid-State Circuits (JSSC), 2023, 59(6), 1697-1708
19. K. Xu, B. Yu, J. Hu, Y. Li, R. B. Staszewski, and Hongtao Xu, “A 50μW Ring-Type Complementary Inverse-Class-D Oscillator with 191.4dBc/Hz FoM and 205.6dBc/Hz FoMA”, 2023 Symposium on VLSI Circuits (VLSI-C), 2023, June 11-16
20. C. Hu, D. Zheng, Y. Yin, J. Lin, Y. Li, W. Li and Hongtao Xu, “A Wideband Sliding Digital-IF Quadrature Digital Transmitter for Multimode NB-IoT/BLE Applications”, IEEE Journal of Solid-State Circuits (JSSC), 2023, 59(5), 1509 - 1520
21. C. Fang, Y. Wang, C. Yang, T. Li, Y. Chen, Y. Lin and Hongtao Xu, “A 22.5–33.5-GHz Hybrid Phase Shifter With Low Phase and Amplitude Error for 5G and Satellite Communication”, IEEE Transactions on Microwave Theory and Techniques (TMTT), 2023, 72(5), 3001-3015
22. C. Hu, D. Zheng, Y. Yin, J. Lin, Y. Li, W. Li, and Hongtao Xu, “A 0.7-to-2.5GHz Sliding Digital-IF Quadrature Digital Transmitter Achieving >40% System Efficiency for Multi-Mode NB-IoT/BLE Applications,” IEEE International Solid-State Circuits Conference (ISSCC), 2023, 472-473
23. J. Li, Y. Yin, H. Chen, J. Lin, Y. Li, X. Jia, Z. Hu, X. Zhang, and Hongtao Xu, “A 4.1W Quadrature Doherty Digital Power Amplifier with 33.6% Peak PAE in 28nm Bulk CMOS,” IEEE International Solid-State Circuits Conference (ISSCC), 2023, 370-371
24. W. Zeng, L. Gao, N. Sun, Hongtao Xu, Q. Xue, X. Zhang, “A 19.7-to-43.8GHz Power Amplifier with Broadband Linearization Technique in 28nm Bulk CMOS,” IEEE International Solid-State Circuits Conference (ISSCC), 2023 372-373
25. C. Wang, W. Li, F. Chen, W. Zuo, Y. Pu, and Hongtao Xu, “A 0.5–4GHz Full-Duplex Receiver with Multi-Domain Self-Interference Cancellation Using Capacitor Stacking Based Second-Order Delay Cells in RF Canceller”, 2022 IEEE Radio Frequency Integrated Circuits Symposium (RFIC), 2022, June 19-21
26. C. Hu, Y. Yin, T. Li, Y. Liu, L. Xiong, and Hongtao Xu, “A Fully-Integrated Wideband Digital Polar Transmitter with 11-bit Digital-to-Phase Converter in 40nm CMOS”, IEEE Journal of Solid-State Circuits (JSSC), 2023, 58(2), 462-473
27. C-C. Yang , T. Li, C. Xu, Y. Chen, Y. Lin , Y. Yin, and Hongtao Xu, A Low-Phase Error Cascode CMOS Variable Gain Amplifier With 180◦ Phase Control for Phase Array Systems, IEEE Transactions on Microwave Theory and Techniques (TMTT), 2022
28. T-Q Fan, B. Jiang, R. Liu, J. Xiu, Y. Lin, and H. Xu, “A Novel Double U-slot Microstrip Patch Antenna Design for Low-Profile and Broad Bandwidth Applications”, IEEE Transactions on Antennas and Propagation (TAP), 2022
29. Y. Li, Y. Yin, D. Zheng, X. Jia, J. Lin, F. Gao, Y. Zhu, L. Xiong, N. Yan, Y. Lu, and Hongtao Xu, “A 15-bit Quadrature Digital Power Amplifier with Transformer-Based Complex Domain Efficiency Enhancement”, IEEE Journal of Solid-State Circuits (JSSC), 2021
30. Y. Yin, L. Xiong, Y. Zhu, B. Chen, H. Min, and Hongtao Xu, “A Broadband Switched-Transformer Digital Power Amplifier for Deep Back-Off Efficiency Enhancement”, IEEE Journal of Solid-State Circuits (JSSC), 2020
31. D. Zheng, Y. Yin, Y. Zhu, L. Xiong, Y. Li, N. Yan, and Hongtao Xu, “A 15b Quadrature Digital Power Amplifier with Transformer-Based Complex-Domain Power-Efficiency Enhancement”, 2020 IEEE International Solid-State Circuits Conference (ISSCC), 2020
32. T. Li, L Xiong, Y. Yin, Y. Liu, H. Min, N. Yan, and Hongtao Xu, “A Wideband Digital Polar Transmitter with Integrated Capacitor-DAC-Based Constant-Envelope Digital-to-Phase Converter”, 2019 IEEE Radio Frequency Integrated Circuits Symposium (RFIC), 2019
33. Y. Yin, L. Xiong, Y. Zhu, B. Chen, H. Min, and Hongtao Xu, “A Compact Dual-Band Digital Polar Doherty Power Amplifier Using Parallel-Combining Transformer”, IEEE Journal of Solid-State Circuits (JSSC), 2019
34. W. Luo, Y. Yin, L. Xiong, T. Li, and Hongtao Xu, “Nonlinear Analytical Model for Switched-Capacitor Class-D RF Power Amplifiers”, IEEE Transactions on Circuits and Systems I: Regular Papers (TCAS-I), 2019
35. Y. Yin, Y. Zhu, L. Xiong, W. Luo, B. Chen, T. Li, N. Yan, and Hongtao Xu, “A Compact Transformer-Combined Polar/Quadrature Reconfigurable Digital Power Amplifier in 28nm Logic LP CMOS”, IEEE Journal of Solid-State Circuits (JSSC invited), 2019
36. L. Xiong, T. Li, Y. Yin, H. Min, N. Yan, and Hongtao Xu, “A Broadband Switched-Transformer Digital Power Amplifier for Deep Back-Off Efficiency Enhancement”, 2019 IEEE International Solid-State Circuits Conference (ISSCC), 2019
37. Y. Zhu, L. Xiong, Y. Yin, W. Luo, B. Chen, T. Li, Hongtao Xu, “A Compact 2.4GHz Polar/Quadrature Reconfigurable Digital Power Amplifier in 28nm Logic LP CMOS”, 2018 IEEE Custom Integrated Circuits Conference (CICC), 2018 (Best Student Paper final list).
38. Y. Yin, L. Xiong, Y. Zhu, B. Chen, H. Min, Hongtao Xu, “A Compact Dual-Band Digital Doherty Power Amplifier Using Parallel- Combining Transformer for Cellular NB-IoT Applications”, 2018 IEEE International Solid-State Circuits Conference (ISSCC), 2018
39. P. Madoglio, Hongtao Xu, K. Chandrashekar et al., “A 2.4GHz WLAN Digital Polar Transmitter with Synthesized Digital-to-Time Converter in 14nm Trigate/FinFET Technology for IoT and Wearable Applications”, 2017 IEEE International Solid-State Circuits Conference (ISSCC), 2017
40. A. Ravi, P. Madoglio, Hongtao Xu et al., “A 2.4-GHz 20–40-MHz Channel WLAN Digital Outphasing Transmitter Utilizing a Delay-Based Wideband Phase Modulator in 32-nm CMOS”, IEEE Journal of Solid-State Circuits (JSSC), 2012
41. W. Tai, Hongtao Xu, Ravi, A. et al., “A Transformer-Combined 31.5 dBm Outphasing Power Amplifier in 45 nm LP CMOS With Dynamic Power Control for Back-Off Power Efficiency Enhancement”, IEEE Journal of Solid-State Circuits (JSSC), 2012
42. P. Madoglio, A. Ravi, Hongtao Xu et al., “A 20dBm 2.4GHz digital outphasing transmitter for WLAN application in 32nm CMOS”, 2012 IEEE International Solid-State Circuits Conference (ISSCC), 2012
43. W. Tai, Hongtao Xu, A. Ravi et al., “A 31.5dBm Outphasing Class-D Power Amplifier in 45nm CMOS with Back-Off Efficiency Enhancement by Dynamic Power Control”. 2011 European Solid-State Circuits Conference (ESSCIRC), 2011
44. Hongtao Xu, Y. Palaskas, A. Ravi et al., “A Flip-Chip-Packaged 25.3 dBm Class-D Outphasing Power Amplifier in 32 nm CMOS for WLAN Application”, IEEE Journal of Solid-State Circuits (JSSC invited), 46(7), 2011
45. Y. Tan, Hongtao Xu, M.A. El-tanani et al., “A flip-chip-packaged 1.8V 28dBm class-AB power amplifier with shielded concentric transformers in 32nm SoC CMOS”, 2011 IEEE International Solid-State Circuits Conference (ISSCC), 2011
46. Hongtao Xu, Y. Palaskas, A. Ravi et al., A highly linear 25dBm outphasing power amplifier in 32nm CMOS for WLAN application”, 2010 European Solid-State Circuits Conference (ESSCIRC), 2010
47. Hongtao Xu, Y. Palaskas, A. Ravi et al., A 28.1dBm class-D outphasing power amplifier in 45nm LP digital CMOS, 2009 Symposium on VLSI Circuits (VLSI-C), 2009
